仙豆棋牌老版本下载 Group will be present at 2017 ProPack Asia which will take place from June 14 to 17 at Bangkok International Trade & Exhibition Centre (BITEC, Booth No: CC39/ Hall 105). 仙豆棋牌老版本下载 will showcase a comprehensive range of hot melt adhesive for Food Packaging & Labeling industry to meet your professional needs.
Venue： Bangkok International Trade & Exhibition Centre
Date：June 14~17 , 2017
Booth No：Hall 105 / CC39
We sincerely invite distributors, R&D partners and anyone who are interested in 仙豆棋牌老版本下载 to visit our booth for further communications. It would be a great pleasure to meet you at the exhibition.