德淵企業

仙豆棋牌老版本下载 Products

2017.01.26

Meet 仙豆棋牌老版本下载 at Printpack India 2017

仙豆棋牌老版本下载 Group will be present at Printpack India 2017 which will take place from February 04 to 08 at India Expo Centre, Greater Noida, NCR. (Booth No: F-11 in Hall No.10).
We will showcase a comprehensive range of packaging hot melt adhesive (bottle labeling, carton closing and the glue stick) and printing series (book binding hot melt adhesive and UV Ink).

Venue: India Expo Centre, Greater Noida, NCR
Date:February 04~08, 2017       
Booth No: F-11 (Hall No.10)
 
We sincerely invite distributors, R&D partners and anyone who are interested in 仙豆棋牌老版本下载 to visit our booth for further communications. It would be a great pleasure to meet you at the exhibition.